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Chip scale package
3.8
TecnologíaISBN | 0639785306085
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Product details
Pages: 500 pages
Author: John H. Lau, Ricky S. W. Lee
Publisher: McGraw-Hill
ISBN: 0639785306085
Format: tapa dura
Language: en
Release date: 1/3/1999
ISBN: 0639785306085
Synopsis of Chip scale package
Este libro técnico es una guía exhaustiva sobre el diseño, materiales, procesos, fiabilidad y aplicaciones de los paquetes a escala de chip (CSP). Escrito por los expertos John H. Lau y Ricky S. W. Lee, la obra profundiza en las innovaciones tecnológicas necesarias para la miniaturización de componentes electrónicos. Es un recurso esencial para ingenieros y profesionales del sector de semiconductores, proporcionando un análisis detallado de los desafíos de fabricación y las soluciones de ingeniería en el empaquetado de circuitos integrados modernos.
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